Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics

The organising and technical committees welcome the participants to the 2nd international conference on "Benefiting from Thermal and Mechanical Simulation in (Micro-) Electronics" (EuroSimE 2001) at Maison de la Chimie, Paris, France. The conference is organised by the thematic network COMPETE (www.compete.tm.fr) with major financial sponsoring by the EC, and technical co-sponsoring by IEEE CPMT and IUTAM.

As the only international conference specially dedicated to various mechanical and thermal issues in (micro-) electronics, EuroSimE2001 aims to:
- emphasis the fact that (micro-)electronics is becoming a major driven force and impulse for the further development of mechanics,
- draw attention from both academic societies and electronic industry for the significant impact of thermal and mechanical related issues on both the electronic industry and modern human life,
- demonstrate the state-of-the-art competencies and the challenges facing mechanics professionals,
- promote further research and development for mechanics of (micro-) electronics,
- promote further development and application of simulation & optimisation methodologies and tools for the electronics industry,